Honghui Yu

Associate Professor

Main Affiliation

Mechanical Engineering


Steinman Hall T- 218


(212) 650 6714


(212) 650-8013

Honghui Yu


Professor Yu received his Ph.D. degree from Princeton University in 1999. After two years of post-doctoral research study at Harvard University, he joined Tyco Telecommunication as a senior member of technical staff in 2001, working on mechanical reliability issues in undersea optical cable and laser amplifier system.  He joined the faculty of CCNY in 2002.  His major research specialty is in the area of material failure behaviors.  His most recent research activities are in both experimental and theoretical studies of cavitation and rupture of soft materials, including gel, dielectric elastomer, membrane and tissues.   He has also been studying the effect of stress in chemical processes and stress corrosion, dislocation based micro-plasticity near metal surface, stress driven microstructure evolution due to various physical and chemical processes, and other general fracture related phenomena.  


  • Ph.D. Mechanical and Aerospace Engineering, Princeton University, 1999
  • M.E. Engineering Mechanics, Tsinghua University, China, 1994
  • B.S. Applied Mathematics, Tsinghua University, China, 1992  

Courses Taught

  • ME 330 Mechanics of Materials
  • ME441 Advanced Stress Analysis
  • ME G450 Mechanics and Physics of materials Behavior
  • ENG. 520 Behavior of inelastic bodies
  • Engr. J500 Elasticity theory
  • ME G440 Micromechanics

Research Interests

  • Cavitation and rupture of soft materials, including gel, dielectric elastomer, membrane and tissues.   
  • Stress driven microstructure evolution and its effects in the reliability of microstructure and devices.
  • Mechanical reliability of large and small structures, problems related to fracture mechanics including thin film delamination and cracking, optimization of interface roughness, and dynamic fracture.
  • Dislocation based micro-plasticity near contacting surface in metal.


  • Liu, Z., Yu, H.H. (2010), A Numerical Study on Stress Relaxation of polycrystalline thin film and its Application in Determining Diffusivity, Thin solid films, Accepted.
  • Sun, P., Liu, Z., Yu, H.H. and Mirkin, M. V. (2008), Effect of Mechanical Stress on Kinetics of Heterogeneous Electron Transfer, Langmuir, 24, 9941.
  • Gao, Y.F., Yu, H.H. and Kim, K.-S.(2008), Micro-plasticity of surface steps under adhesive contact. Part II. Multiple-dislocation mediated surface hardening, J. Mech. Phys. Solids, 56 (2008) 2759– 2772.
  • Yu, H.H., Shrotriya, P., Gao, Y.F. and Kim, K.S.(2007) Micro-plasticity of surface steps under adhesive contact. Part I. Surface yielding controlled by single-dislocation nucleation, J. Mech. Phys. Solids 55, 489-516.
  • Liu, Z. and Yu, H.H. (2006), A Numerical Study on the Effect of Mobilities and Initial Profile in Thin Film Morphology Evolution, Thin Solid Films 513, 391-398.
  • Yu, H.H. (2005) Crack Nucleation from a single notch caused by stress-dependant surface reaction, International journal of solids and structures 42, 3852-3866.
  • Yu, H.H. and J.W. Hutchinson (2002) The influence of Substrate Compliance on Thin Film Buckling Delaminaton, Inter. J. Fracture, 113,39-55.
  • Yu, H.H., M.Y. He and J.W. Hutchinson (2001) The Edge Effects in Thin Film Delamination, Acta Materialia 49, 93-107.
  • Yu, H.H., Suo, Z. (2000) Intersonic Crack Growth Along an Interface, Proc. Roy. Soc. London A 456, pp. 223-146.
  • Yu, H.H., Suo, Z., (1999) An Axysymmetric Model of Pore-Grain Boundary Separation, J. Mech. Phys. Solids 47, 1131-1155.
  • Yu, H.H., Suo, Z., (1999) Delayed Fracture of Ceramics Caused by Stress-Dependent Surface Reactions, Acta Materialia 47, 77-88.
  • Yu, H.H., Suo, Z., (1998) Model of Wafer Bonding by Elastic Accommodation, J. Mech. Phys. Solids, 46, 829-840